Description
Physical Properties:
- Thickness : 1 mm
- Total weight (g/m2) :1500
- Weight of fiberglass fabric (g/m2) : 852
- Double side with silicone coated
- Tensile strength (N/5 cm ) Warp : ≥5500 Weft : ≥ 5000
- Width ( m ) : 1.5
- Operation temperature range ( ℃ ) ： – 50 ～ 250
Features & Benefits :
- Excellent dimensional stability at high temperature
- (No distortion, shrinkage/expansion at 260℃ continuous usage condition.)
- Superior adhesion and holding power of silicone adhesive
- No adhesive residue after removal
- Longer life time of silicone resin side
- Easy cleaning using cleaning roller allows extended lifetime
- Good surface flatness allows the whole area of FPC to be fixed
- Adhesion level of silicone compound can be controlled for customer’s requirement
(Low – Moderate – Standard – High – High2 – High3)
- Excellent cut & die-cut properties
- Easy fixing and easy removal
- Provides flexibility for carrier design
Applications
1. SMT Process
– Reflow Soldering of FPC, Thin Rigid PCB & Rigid-flex PCB, etc
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2.Assembly Process (including curing, wire bonding, etc)
– MEMS Microphone
– Camera Module, Vibration Motor
– Wireless LAN Module, GPS Module
– RF Module
– Accelerometer Sensor, Gyro Sensor
– Humidity Sensor, Temperature Sensor, etc.
– Flip Chip Mounting Process
– Flip Chip Mounting
3.LED Packaging Process
– LED Chip Bonding, Wire Bonding, Molding, etc.
4.Display Panel Process
– Carrier of LCD Panel, OLED Panel
– Temporary Fixing of Touch Panel
– Detaching Protection Films from LCD Panel
or Polarizing Film
– Probe Station
– Fixing of Electrostatic Chuck
5.Substrate Manufacturing Process
– Dicing of LTCC, CSP or Inductor substrates
– MLCC Termination
– Micro-polishing of Thin Package Substrate
